1. 2. 3. material content data sheet sales product name sak-xc2234l-20f66l aa issued 29. august 2013 ma# MA000974572 package pg-lqfp-64-22 weight* 369.75 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 17.352 4.69 4.69 46929 46929 leadframe inorganic material phosphorus 7723-14-0 0.032 0.01 88 non noble metal zinc 7440-66-6 0.130 0.04 352 non noble metal iron 7439-89-6 2.600 0.70 7031 non noble metal copper 7440-50-8 105.558 28.55 29.30 285487 292958 wire noble metal gold 7440-57-5 1.683 0.46 0.46 4551 4551 encapsulation organic material carbon black 1333-86-4 1.150 0.31 3111 plastics epoxy resin - 31.057 8.40 83996 inorganic material silicondioxide 60676-86-0 197.846 53.50 62.21 535084 622191 leadfinish non noble metal tin 7440-31-5 4.066 1.10 1.10 10996 10996 plating noble metal silver 7440-22-4 1.611 0.44 0.44 4356 4356 glue plastics epoxy resin - 1.666 0.45 4505 noble metal silver 7440-22-4 4.997 1.35 1.80 13514 18019 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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